When ordering the circuit boards, care is taken to ensure that the maximum possible number of individual circuit boards, the “panels”, are accommodated on an overall circuit board within the machine-processable dimension. After completing the assembly process, SMT or THT or as a mixed assembly of both, the assembled circuit boards are divided into the individual circuit boards, known as “depaneling”. Depending on the requirements of the IPC class, a specific accuracy in the depaneling process is also prescribed. In general it can be said that the higher the IPC class, the higher the depaneling accuracy. The depaneling process can be derived from this aspect.